半导体器件与微纳加工、生物电子与生物传感、植入式神经技术、脑机接口与神经工程等
semiconductor devices and micro/nano fabrication, bioelectronics and biosensing, implantable neurotechnology, brain-machine interfaces and neuroengineering, etc
2024.3-至今 同济大学长聘副教授，博士生导师
2023.12-至今 同济大学附属上海市第四人民医院双聘PI
2020.9-2023.11康涅狄格大学，博士后研究员
2019.1-2020.8密苏里大学哥伦比亚分校，博士后研究员
2018.7香港城市大学，博士
2024.3-now Tongji University, Associate Professor
2023.12-now Shanghai Fourth People’s Hospital, Associate Professor
2020.9-2023.11 University of Connecticut, Postdoc
2019.1-2020.8 University of Missouri-Columbia, Postdoc
2018.7 City University of Hong Kong, PhD
吴广付，同济大学长聘副教授，博士生导师，同济大学附属上海市第四人民医院双聘PI。博士毕业于香港城市大学，之后在美国密苏里大学哥伦比亚分校（2019-2020）和美国康涅狄格大学（2020-2023）从事博士后研究。2024年3月加入同济大学医学院，主要从事半导体器件与微纳加工、生物电子与生物传感、植入式神经技术、脑机接口与神经工程等涉及工程学、材料学、医学、电子学等交叉学科的研究，聚焦于柔性电子、半导体芯片、微流控等在生物医学特别是脑科学方面的应用，取得了一系列研究成果。以第一/通讯作者（含共同）在Science Advances，Nano Letters，Angew. Chem. Int. Ed.等国际高水平学术期刊发表学术论文13篇，多项研究成果入选热点论文、封面论文。参与撰写英文专著一个章节，在MRS、BMES、ACS、IEEE等国际重要学术会议作学术报告10余次。主持国家自然科学基金优秀青年科学基金（海外）、上海市领军人才（海外）、同济大学“青年百人计划”A岗等项目。
Guangfu Wu, Associate Professor of Tongji University and affiliated Shanghai Fourth People’s Hospital. He received his PhD degree from the City University of Hong Kong. After that, he worked as a postdoc at the University of Missouri-Columbia (2019-2020) and the University of Connecticut (2020-2023). He joined Tongji University School of Medicine in March 2024, mainly engaged in the research in interdisciplinary fields such as semiconductor devices and micro/nano fabrication, bioelectronics and biosensing, implantable neurotechnology, brain-machine interfaces and neuroengineering. Particularly, his research focuses on the applications of soft electronics, semiconductor chips, and microfluidics in brain science, and a series of research achievements have been achieved. He has published 13 papers (as first/corresponding author) in top journals such as Sci. Adv., Nano Letters, Angew. Chem. Int. Ed. The paper published in Angew. Chem. Int. Ed. was featured on the Journal Back Cover and later became a hot paper. The paper published in Advanced Healthcare Materials was featured on the Journal Inside Cover. He participated in writing a chapter of an English monograph and gave academic presentations at more than 10 important international academic conferences such as MRS, BMES, ACS, and IEEE. He is hosting several projects such as National Natural Science Fund for Excellent Young Scientist Fund Program (Overseas), Shanghai Outstanding Academic Leaders Plan (Overseas), and Tongji University Hundred Young Talent Project (Category A).
